4J29（29HК Kovar、KV-1、29HК-BИ）
1.Composition(wt%):
|
C
|
Cr
|
Ni
|
Mo
|
Si
|
Mn
|
P
|
S
|
Fe
|
Co
|
Cu
|
|
≤0.03
|
≤0.2
|
28.5-29.5
|
≤0.2
|
≤0.3
|
≤0.5
|
≤0.02
|
≤0.02
|
balance
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16.8-17.8
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≤0.2
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2.Physical Properties
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density
(g/cm3)
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Thermal conductivity
(W/m·K)
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Electrical resistivity
(μΩ·cm)
|
|
8.3
|
17
|
45
|
3.Properties:
1).Strip properties：
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condition
|
Tensile strengthσ/N·mm2
|
|
soft
|
<570
|
|
1/4 hard（H1/4）
|
520-630
|
|
1/2 hard（H1/2）
|
590-700
|
|
3/4 hard（H3/4）
|
600-770
|
|
hard
|
>700
|
2).Wire properties：
|
condition
|
Tensile strength
σ/N·mm2
|
|
soft
|
<585
|
|
1/4 hard（H1/4）
|
585-725
|
|
1/2 hard（H1/2）
|
655-795
|
|
3/4 hard（H3/4）
|
725-860
|
|
hard
|
>860
|
3).Average expansion coefficient of alloy：
|
condition
|
Average expansion coefficient
(10-5/℃)
|
|
20℃~400℃
|
20℃~450℃
|
|
Standard heat treatment
|
4.6-5.2
|
5.1-5.5
|
4.Characteristics:
Similar thermal expansion coefficient to Silicon boron hard glass between 20～450 ℃，high Curie point,
good organizational stability at low temperature.Density of alloy oxide film, which can cover glass infiltration.
And do not generate with mercury. In - 70 ℃ for 30 min frozen, don't appear martensite structure.
5.Structure:
For single austenitic organization after heat treatment.
6.Applications:
Mainly used in electric vacuum components such as tubes, oscillation tubes, ignitron, magnetron, transistors,
the wires of a sealing plug, relays, integrated circuits, chassis, casing glass seal, support, etc.
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